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Wafer Scratching
In December, 2005, Samsung Semiconductor and Fabworx Solutions
published an article in Solid State Technology magazine
detailing the reduction of robot-related wafer scratches and the
increase of yield and productivity through using the Fabhp Robot.
Fabs operating cluster tools from the 1990s frequently report
robot-related wafer scratching as a common source of yield loss.
When scratching occurs, the probability of killing a die is nearly
100%. The dominant cause of wafer scratching in these tools is
droop, which occurs as the robot ages. Faced with an ongoing yield-loss
issue, a 200mm memory fab analyzed defect data to identify droop-related
scratching in a set of tools.
After evaluating options, Samsung Austin Semiconductor LP installed
the Fabhp robot, which eliminated scratching and resulted in a
payback on investment from higher yields within 10 weeks. Because
the Fabhp robot runs at higher speeds, tool productivity also
increased by 15%.
DOWNLOAD the ARTICLE
(requires Acrobat Reader)
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